Process and material challenges associated with the next generation of LTCC based products

Proceedings - Electrochemical Society

Volumn 27, Issue , 2003, Pages 141-155

  Elvey, E ^a   Wang, V ^a   Folk, M ^a   Tan, C ^a   Barlow, F ^a   Elshabini, A ^a  

^a University of Arkansas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL SYSTEMS; HIGH FREQUENCY CIRCUITS; LOW TEMPERATURE COFIRED CERAMICS (LTCC); TAPE INSTABILITY;

DIGITAL DEVICES; ELECTRIC INDUCTORS; ELECTRIC LINES; LOW TEMPERATURE EFFECTS; NATURAL FREQUENCIES; NETWORKS (CIRCUITS); PROBLEM SOLVING; ROBUSTNESS (CONTROL SYSTEMS); STRIP TELECOMMUNICATION LINES;

CERAMIC MATERIALS;

EID: 21644479212     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. R. Kulke et al. "LTCC - Multilayer Ceramic for Sensor and Wireless Applications." 8 pp. Online. Internet. 5 October 2003. Available: http://www.taconic-add.com/de/pdf/technicalarticles-ltccmultilayer.pdf.
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4. D. M. Pozar, Microwave Engineering, pp. 153-166, John Wiley Sons, 1998.
5. Tanaka, Hiroki, Gunichi Takaahashi and Norio Okabe. "2 Metal Layer TAB Tape for TBGA." 25 January 2003. Available: http://www2.hitachi-cable. co.jp/microBGA/ubga/designguide/paper/2metal.pdf.
6. Hughes, Daniel C., "Screen Printed Feature Size Capabilities," Ceramic Interconnect Technology Conference Proceedings, pp.58-62, April 7-9, Denver, CO, 2003.
7. Lahti, Markku, "Realisation of Narrow Conductor Lines in LTCC Modules by Etching Technique," Proceedings of European Microelectronics Interconnection and Packaging Symposium, June 16-18, Krakow, Poland, 2002.
8. Heiko Thust, Karl-heinz Drue, Torsten Thelemann, Erich K. Polzer, and Jens Muller, "Is Buried Better? -Evaluation the Performance of Buried Resistors in LTCCs," Advanced Packaging, March /April, pp. 40-46, 1998.
9. Kieran Denlaney, John Barrett, John Barton, and Rory Doyle, "Characterization and Performance Prediction for Integral Resistors in Low Temperature Cofired Ceramic technology," IEEE Transactions on Advanced Packaging, Vol. 22, No. 1, pp. 78-85, February, 1999.
10. nd Electronic Components and Technology Conference, pp. 516-525, May 28-31, San Diego, 2002.