Photoimageable silver cofireable conductor compatible with 951 Green TapeTM

International Journal of Microcircuits and Electronic Packaging

Volumn 21, Issue 4, 1998, Pages 355-360

  Skurski, Michael A ^a   Smith, Michael A ^a,b   Draudt, Richard R ^a,h   Amey, Daniel I ^a,c,d,e,f,g   Horowitz, Samuel J ^a,c,i,j   Champ, Michael J ^a,c,k  

^a DUPONT COMPANY   (United States)

^b Dupont's Gn Tape Prototype Facility   (United States)

^c Dupont's Thick Film Electron M ^*

^d Institute of Electrical and Electronics Engineers   (United States)

^e Intl Electronic Packaging Society

^f PENNSYLVANIA STATE UNIVERSITY   (United States)

^g LEHIGH UNIVERSITY   (United States)

^h Green Tape Material System

ⁱ Steering Comm of Mkt Res Council

^j RICE UNIVERSITY   (United States)

^k Dupont's Photopolymers Electron M   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

PHOTOIMAGEABLE SILVER COFIREABLE CONDUCTORS;

BANDPASS FILTERS; CAPACITORS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC CONDUCTORS; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; LAMINATING; PASSIVE NETWORKS; SILVER; THICK FILM CIRCUITS; THIN FILM CIRCUITS;

THICK FILM DEVICES;

EID: 0032226450     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

1. Samuel J. Horowitz and C. R. S. Needes, "Smart Materials: Advanced Technology for Hybrid Circuits", Future Circuits International, Technology Publishing Co Ltd, London, Vol. 1, pp. 25-30, 1997.
2. R.R. Tummala, E.J. Rymaszewski, "Microelectronic Packaging Handbook", New York, Van Nosrtrand, Chapter 7, pp. 501-511, 1989.
3. David L. Wilcox Sr., Rong Fong Huang, and Dean Anderson, "The Ceramic Integrated Circuit (MCIC) Technology: Opportunities and Challenges", 1997 Proceedings of the International Symposium on Microelectronics, ISHM '97, Philadelphia, Pennsylvania, pp. 17-23, October 1997.
4. J. Estes, R Kommrusch, and R.F. Huang, "Integration of a Receiver Front-End in Multilayer Ceramic Integrated Circuit Technology", Proceedings of 1997 Wireless Communications Conference, Boulder, Colorado, August 1997.
5. Michael O'Hearn, "Designing a Frequency Synthesizer Module using Low-Temperature Cofired Ceramic", RF Design, November 1996.
6. Daniel I. Amey and Samuel J. Horowitz, "Test Characterize High-Frequency Material Properties", Microwaves & RF, August 1997.
7. st Annual ISHM New England, April 1994.
8. J. J. Felten, M. A. Skurski, "Fodelâ and Diffusion Patterningä for High Density Multilayer and Packaging: Materials and Processing", American Ceramic Society, Cincinnati, Ohio, May 1998,.
9. J.P. Cazenave and T.R. Suess. "Fodel®, "Photoimageable Materials-a Thick Film Solution for High Density Multichip Modules" Proceedings of the International Symposium on Microelectronics, ISHM '93, pp.483-488, 1993.
10. J.P. Cazenave, "High Density Interconnections with thick-film MCMs", Solid State Technology, May 1994.
11. th European Microelectronics Conference, Venice, Italy, pp. 229-236, May 1997.
12. DARPA, Defense Advanced Research Projects Agency, "Low-Cost Packaging For Wireless Communications In A Global Market, TRP Contract 5114".
13. DuPont Green Tape™ Material System, Design and Layout Guideline, January 8, 1998.