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Volumn , Issue , 2003, Pages 167-170
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Technology aspects of a CMOS neuro-sensor: Back end process and packaging
c
SIEMENS AG
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 84876666205
PISSN: 19308876
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESSDERC.2003.1256837 Document Type: Conference Paper |
Times cited : (16)
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References (5)
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