|
Volumn , Issue , 2006, Pages 478-483
|
Micro bump formation by using a super fine inkjet system
|
Author keywords
Direct fabrication and micro bumping; Micro wiring; Super fine inkjet
|
Indexed keywords
CONDUCTIVE PASTES;
CURRENT PACKAGING;
DIRECT FABRICATIONS;
FINE PATTERN PROCESSING;
MICRO WIRING;
NANO-METAL PARTICLES;
SUPER-FINE INKJET;
THREE-DIMENSIONAL STRUCTURE;
ASPECT RATIO;
DROPS;
METAL DRAWING;
MICROELECTRONICS;
|
EID: 84876568910
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (7)
|
References (9)
|