SCOPUS 정보 검색 플랫폼

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 100-104

Characterization of carbon nanotube filled conductive adhesive

a UNIVERSITY OF KENTUCKY (United States)

Author keywords

Carbon nanotube (CNF); Epoxy; Isotropic conductive adhesives (ICA); Multiwall nanotue (MWNT)

Indexed keywords

ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICALLY CONDUCTIVE ADHESIVES; ENVIRONMENTAL LEGISLATIONS; EPOXY; HIGH ELECTRICAL CONDUCTIVITY; HIGH FREQUENCY PERFORMANCE; ISOTROPIC CONDUCTIVE ADHESIVES; MULTIWALL NANOTUE (MWNT);

ELECTRIC CONDUCTIVITY; LEAD ALLOYS; MECHANICAL PROPERTIES; MICROELECTRONICS; SOLDERING; THERMAL CONDUCTIVITY; TIN; TIN ALLOYS;

CARBON NANOTUBES;

EID: 84876561932 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (5)

References (7)

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4
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6
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7
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- Jing Li, Dr. Janet K. Liumpp, Electrical and Mechanical Characterization of Carbon Nanotube Filled Conductive Adhesive, IEEE Aerospace Conference, Big Sky. MT, 2006.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.