Future of multiple-e-beam direct-write systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8323, Issue , 2012, Pages

  Lin, Burn J ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

e beam lithography; lithography cost reduction; maskless lithography; massive parallelism; multiple e beam direct write lithography; multiple e beam maskless lithography

Indexed keywords

COST REDUCTION; PHOTOLITHOGRAPHY; TOOLS;

DIRECT-WRITE LITHOGRAPHY; E-BEAM LITHOGRAPHY; HIGH VOLUME MANUFACTURING; HIGH-SPEED DIGITAL ELECTRONICS; MASK-LESS LITHOGRAPHY; MASSIVE PARALLELISM; PROTOTYPING TOOLS; WAFER PRODUCTION;

TECHNOLOGY;

EID: 84875943396     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.919747     Document Type: Conference Paper

References (17)

1. M.B. Heritage, "Electron-projection microfabrication system," J. Vac. Sci. Technol. 12, 1135-1140 (1975).
2. W.R. Hunter, L. Ephrath, W.D. Grobman, C.M. Osburn, B.L. Corwder, A. Cramer, and H.E. Luhn, "1 μm MOSFET VLSI Technology: Part V - A single level polysilicon technology using electron-beam lithography," IEEE Tran. Electron Devices ED-26, 353-359 (1979).
3. H.C. Pfeiffer, "Advanced e-beam systems for manufacturing," Proc. SPIE 1671, 100-110 (1992).
4. J.P. Ballantyne, "Electron-beam fabrication of chromium master masks," J. Vac. Sci. Technol. 12, 1257-1260 (1975).
5. Christof Klein, Jan Klikovits, Hans Loeschner, and Elmar Platzgummer, "eMet 50 keV electron multi-beam Mask Exposure Tool," Proc. SPIE 7970-11, (2011).
6. J. Gramss, et al., "Multi-shaped e-beam technology for maskwriting," Proc. SPIE 7823, 782309-1 (2010).
7. S.J. Lin et al., "Characteristics performance of production-worthy multiple e-beam maskless lithography," Proc. SPIE 7637, 763717 (2010)
8. B.J. Lin, "Succeeding optical lithography with multiple e-beam direct write," MNC Japan, (2007).
9. B.J. Kampherbeek, "High throughput maskless lithography," CPL Workshop Vienna, (2005).
10. M.J. Wieland et al., "Throughput enhancement technique for MAPPER maskless lithography," Proc. SPIE 7637, 76371Z (2010).
11. J.H. Chen et al, "Implication of multiple e-beam maskless lithography on process, design, and CAD tools," Proc. SPIE 8323, 832317 (2012).
12. S.J. Lin et al," Characteristics performance of production-worthy multiple e-beam maskless lithography," Proc. SPIE 7637, 763717 (2010).
13. S.J. Lin et al, "Imaging performance of production-worthy multiple-E-beam maskless lithography," Proc. SPIE 7520, 752009 (2009).
14. P. Petric, "Reflective electron beam lithography(REBL), a novel approach to high speed maskless e-beam direct write lithography," 52nd International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication, (2008)
15. M.A. McCord et al, "REBL: design progress toward 16nm half-pitch electron-beam lithography," Proc. SPIE 8328, 8328-36 (2012).
16. C. Klein, E. Platzgummer, H. Loeschner, G. Gross, "PML2: The mask-less multi-beam solution for the 32nm node and beyond," Sematech Litho Forum, (2008).
17. S.M. Chang et al," Patterning fidelity on low-energy multiple-electron-beam direct write lithography," Proc. SPIE 6921, 69211R (2008)