Effects of Ce4+ on the structure and corrosion resistance of electroless deposited Ni-Cu-P coating

Surface and Coatings Technology

Volumn 222, Issue , 2013, Pages 25-30

  Liu, Guichang ^a   Huang, Zongxiang ^a   Wang, Lida ^a   Sun, Wen ^a   Wang, Suilin ^b   Deng, Xinlv ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b BEIJING UNIVERSITY OF CIVIL ENGINEERING AND ARCHITECTURE   (China)

Author keywords

Corrosion resistance; Electroless deposition; Ni Cu P; Rare earth elements

Indexed keywords

COATING SURFACE; CORROSION CURRENT DENSITIES; ELECTROLESS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; GRAIN SIZE; INDUCTIVELY COUPLED PLASMA-ATOMIC EMISSION SPECTROMETRY; NI-CU-P; POLARIZATION CURVES;

ATOMIC EMISSION SPECTROSCOPY; CERIUM; COATINGS; DEPOSITS; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTROLESS PLATING; FLUE GASES; NICKEL; RARE EARTH ELEMENTS; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

CORROSION RESISTANCE;

EID: 84875810121     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2013.01.053     Document Type: Article

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