An improved insulation system for the LHC main 13 kA interconnection splices

IEEE Transactions on Applied Superconductivity

Volumn 23, Issue 3, 2013, Pages

  Lackner, Friedrich ^a   Savary, Frédéric ^a   Prin, Herve ^a   Lopez, Roberto ^a  

^a CERN   (Switzerland)

Author keywords

Dielectric breakdown; dielectric insulation; electromagnetic forces; Large Hadron Collider (LHC) interconnection

Indexed keywords

CONSOLIDATION PROGRAMS; CRITICAL PERFORMANCE PARAMETERS; DIELECTRIC INSULATIONS; ELECTROMAGNETIC FORCES; FUNCTIONAL REQUIREMENT; LARGE HADRON COLLIDER LHC; MECHANICAL RESTRAINTS; NUMERICAL OPTIMIZATIONS;

ELECTRIC BREAKDOWN; MICROSTRIP DEVICES; OPTIMIZATION; RINGS (COMPONENTS); SHAFTS (MACHINE COMPONENTS); STRESSES; SUPERCONDUCTING MAGNETS; SUPERFLUID HELIUM; TELLURIUM COMPOUNDS;

SOUND INSULATION;

EID: 84875778781     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2013.2240757     Document Type: Article

References (13)

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