Development of a new insulation approach for the LHC main 13 kA interconnection splices

IEEE Transactions on Applied Superconductivity

Volumn 22, Issue 3, 2012, Pages

  Lackner, F ^a   Bertinelli, F ^a   Fessia, P ^a   Lopez, R ^a   Prin, H ^a   Tock, J Ph ^a  

^a CERN   (Switzerland)

Author keywords

Dielectric breakdown; dielectrics insulation; electromagnetic forces; LHC interconnection

Indexed keywords

CONCEPT-BASED; DIELECTRIC INSULATIONS; ELECTROMAGNETIC FORCES; EMPIRICAL APPROACH; LARGE HADRON COLLIDER; LHC INTERCONNECTION; LORENTZ; MANUFACTURING TECHNIQUES; STATE OF THE ART;

COLLIDING BEAM ACCELERATORS; ELECTRIC BREAKDOWN; INSULATION; TELLURIUM COMPOUNDS;

PAPER;

EID: 84862546572     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2011.2178978     Document Type: Article

References (5)

1. F. Bertinelli et al., "Production and quality assurance of main busbar interconnection splices during the LHC 2008-2009 shutdown," IEEE Trans. Appl. Superconductivity, vol. 21, no. 3, pp. 1786-1790.
2. F. Bertinelli et al., Towards a Consolidation of LHC Superconducting Splices for 7 TeV Operation CERN/ATS 2010-144.
3. P. Fessia, "Splice consolidation: What we will do: Status of main technical solutions," in LHC Performance Workshop - Chamonix 2010.
4. F. Rodriguez-Mateos, Voltage Withstands Levels for Electrical Insulation Tests on Components and Busbar Cross Sections for the Different LHC Machine Circuits CERN Engineering Specification, EDMS Nr. 90327.
5. G. Willering, Electro-Thermal and Mechanical Validation Experiment on the LHC Main Busbar Splice Consolidation CERN Technical note, EDMS Nr. 1160067.