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Volumn , Issue , 2007, Pages 495-499

LTCC multilayer technology enables very compact 20 GHz switch unit for space applications

Author keywords

Ka Band; LTCC; Microwave; Satellite application

Indexed keywords

ELECTRICALLY CONDUCTIVE; KA BAND; LTCC; MULTILAYER STRUCTURES; MULTILAYER TECHNOLOGY; MULTIMEDIA SATELLITES; SATELLITE APPLICATIONS; TECHNOLOGICAL PROCESS;

EID: 84875356303     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (6)

References (5)
  • 1
    • 42549141619 scopus 로고    scopus 로고
    • Technology benchmarking of high resolution structures on LTCC for microwave circuits
    • Dresden, Germany
    • J. Müller et al. "Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits", 2006 Electronics SystemIntegration Technology Conference, Dresden, Germany.
    • 2006 Electronics SystemIntegration Technology Conference
    • Müller, J.1
  • 2
    • 84875344698 scopus 로고    scopus 로고
    • Development and evaluation of fine line structuring methods for microwave packages in satelliteapplications
    • June 12-15, Oud Sint Jan, Brugge, Belgium
    • G. Reppe et al. "Development and Evaluation of Fine Line Structuring Methods for Microwave Packages in SatelliteApplications", 15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Oud Sint Jan, Brugge, Belgium.
    • (2005) 15th European Microelectronics and Packaging Conference & Exhibition
    • Reppe, G.1
  • 3
    • 33847121772 scopus 로고    scopus 로고
    • High functional density lowtemperature co-fired ceramic modules for satellite communications
    • October 3-7, Paris, France
    • J. Trabert et al. "High functional density lowtemperature co-fired ceramic modules for satellite communications", 35th European Microwave Conference, October 3-7, 2005, Paris, France.
    • (2005) 35th European Microwave Conference
    • Trabert, J.1
  • 4
    • 33847146728 scopus 로고    scopus 로고
    • Progress in passive integration of planar and 3D coils by using photoimageable inks on and into LTCC
    • Long Beach, California USA, November
    • R. Perrone, H. Thust, K.-H. Drüe "Progress in passive integration of planar and 3D coils by using photoimageable inks on and into LTCC", 2004 IMAPS, 37th Int. Symposium on Microelectronics, Long Beach, California USA, November 2004.
    • (2004) 2004, IMAPS, 37th Int. Symposium on Microelectronics
    • Perrone, R.1    Thust, H.2    Drüe, K.-H.3
  • 5
    • 62349126832 scopus 로고    scopus 로고
    • Development and evaluation of photodefined elements for microwave modules in LTCC for space applications
    • June 12-15, Oud Sint Jan, Brugge, Belgium
    • R. Perrone et al. "Development and Evaluation of photodefined elements for microwave modules in LTCC for space applications", 15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Oud Sint Jan, Brugge, Belgium.
    • (2005) 15th European Microelectronics and Packaging Conference & Exhibition
    • Perrone, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.