Silver-coated copper nanowires with improved anti-oxidation property as conductive fillers in low-density polyethylene

Canadian Journal of Chemical Engineering

Volumn 91, Issue 4, 2013, Pages 630-637

  Luo, Xiaoxiong ^a,b   Gelves, Genaro A ^a   Sundararaj, Uttandaraman ^a   Luo, Jing Li ^b  

^a UNIVERSITY OF CALGARY   (Canada)

^b UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Anti oxidation; Electrical resistivity; Low density polyethylene; Polymer nanocomposite; Silver coated copper nanowires

Indexed keywords

ANTI-OXIDATION; ANTI-OXIDATION PROPERTIES; CHEMICAL PLATING; CONDUCTIVE FILLERS; COPPER NANOWIRES; ELECTRICAL RESISTIVITY; FORMATION-OF-COPPER OXIDES; POLYMER NANOCOMPOSITE; ROOM TEMPERATURE; SILVER COATINGS; SILVER CONTENT; VOLUME ELECTRICAL RESISTIVITY; VOLUME PERCENTAGE; WEIGHT GAIN;

COATINGS; COMPRESSION MOLDING; COPPER; FILLERS; NANOCOMPOSITES; NANOWIRES; POLYETHYLENES; SILVER; SILVER PLATING; THERMOPLASTICS;

ELECTRIC CONDUCTIVITY OF SOLIDS;

EID: 84874765137     PISSN: 00084034     EISSN: 1939019X     Source Type: Journal    
DOI: 10.1002/cjce.21701     Document Type: Article

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