Mathematical modeling and numerical characterization of composite thermoelectric devices

International Journal of Thermal Sciences

Volumn 67, Issue , 2013, Pages 53-63

  Reddy, B V K ^a   Barry, Matthew ^a   Li, John ^a   Chyu, Minking K ^a  

^a University of Pittsburgh   (United States)

Author keywords

Composite; Conventional; Numerical model; Performance; Thermoelectrics; Waste heat recovery

Indexed keywords

CONVECTIVE HEAT TRANSFER COEFFICIENT; CONVENTIONAL; ELECTRICAL CURRENT; HEAT INPUT; HOT SURFACE; INTERNAL RESISTANCE; LOAD RESISTANCES; NUMERICAL CHARACTERIZATION; OPTIMUM LOADS; OPTIMUM VALUE; PERFORMANCE; PERFORMANCE CHARACTERISTICS; POWER OUT PUT; SEEBECK; SEMICONDUCTOR THICKNESS; TEMPERATURE DEPENDENT; THERMOELECTRIC; THERMOELECTRIC DEVICES; THERMOELECTRIC PERFORMANCE; THERMOELECTRICS;

ATMOSPHERIC TEMPERATURE; COMPOSITE MATERIALS; CONDUCTIVE MATERIALS; CONVERSION EFFICIENCY; HEAT TRANSFER COEFFICIENTS; NUMERICAL MODELS; THERMOELECTRICITY; WASTE HEAT UTILIZATION;

HEAT RESISTANCE;

EID: 84874649061     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2012.11.004     Document Type: Article

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