The high frequency electrical properties of interconnects on a flexible polyimide substrate including the effects of humidity

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 1, 2011, Pages 4-15

  McGibney, E ^a   Barton, J ^b   Floyd, L ^b   Tassie, P ^b   Barrett, J ^c  

^a ANALOG DEVICES   (Ireland)

^b UNIVERSITY COLLEGE CORK   (Ireland)

^c Ireland   (Ireland)

Author keywords

Electrical characterization; flexible substrates; high frequency; material properties

Indexed keywords

ELECTRICAL CHARACTERIZATION; ELECTROMAGNETIC SIMULATION; FLEXIBLE POLYIMIDE SUBSTRATE; FLEXIBLE SUBSTRATE; HIGH FREQUENCY; HIGH-SPEED DIGITAL SYSTEMS; MATERIAL PROPERTY; MICROSTRIP TRANSMISSION LINES;

DIELECTRIC MATERIALS; MICROSTRIP LINES; MICROWAVE DEVICES; POLYIMIDES; RESONATORS; SCATTERING PARAMETERS; SUBSTRATES;

ELECTRIC PROPERTIES;

EID: 84874265407     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2100731     Document Type: Article

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