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Materials Science Forum

Volumn 740-742, Issue , 2013, Pages 431-434

Study on the correlation between film composition and piezoresistive properties of PECVD SixCy thin films

(2) Fraga, Mariana A a,b Koberstein, Leandro L c

a UNIVERSIDADE REGIONAL DO NOROESTE DO ESTADO DO RIO GRANDE DO SUL (Brazil)

b INSTITUTO TECNOLÓGICO DE AERONÁUTICA (Brazil)

c Faculty of Technology of Sao Jose dos Campos (Brazil)

Author keywords

Film composition; Non stoichiometric silicon carbide thin films; PECVD; Piezoresistive properties

Indexed keywords

CARBON FILMS; PLASMA CVD; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; SILICON CARBIDE;

FILM COMPOSITION; NON-STOICHIOMETRIC; PIEZORESISTIVE PROPERTIES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITIONS (PE CVD); SILICON CARBIDE THIN FILM; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMALLY OXIDIZED; THIN FILM RESISTORS;

THIN FILMS;

EID: 84874075522 PISSN: 02555476 EISSN: 16629752 Source Type: Book Series
DOI: 10.4028/www.scientific.net/MSF.740-742.431 Document Type: Conference Paper

Times cited : (2)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.