-
1
-
-
70849102194
-
Characterization of copper powder particles obtained by electrodeposition as function of different current densities
-
Maksimovic V., Pavlovic Lj., Pavlovic M., Tomic M. Characterization of copper powder particles obtained by electrodeposition as function of different current densities. Journal of Applied Electrochemistry 2009, 39:2545-2552.
-
(2009)
Journal of Applied Electrochemistry
, vol.39
, pp. 2545-2552
-
-
Maksimovic, V.1
Pavlovic, L.2
Pavlovic, M.3
Tomic, M.4
-
2
-
-
78650027490
-
Characterization and morphology of copper powder particles as a function of different electrolytic regimes
-
Pavlovic M., Pavlovic Lj., Maksimovic V., Nikolic N., Popov K. Characterization and morphology of copper powder particles as a function of different electrolytic regimes. International Journal of Electrochemistry Science 2010, 5:1862-1878.
-
(2010)
International Journal of Electrochemistry Science
, vol.5
, pp. 1862-1878
-
-
Pavlovic, M.1
Pavlovic, L.2
Maksimovic, V.3
Nikolic, N.4
Popov, K.5
-
3
-
-
77952290995
-
Effect of electrolysis parameters on the morphologies of copper powder obtained in a rotating cylinder electrode cell
-
Orhan G., Hapci G. Effect of electrolysis parameters on the morphologies of copper powder obtained in a rotating cylinder electrode cell. Powder Technology 2010, 201:57-63.
-
(2010)
Powder Technology
, vol.201
, pp. 57-63
-
-
Orhan, G.1
Hapci, G.2
-
4
-
-
73349101408
-
Characterization of ultrafine copper powder prepared by novel electrodeposition method
-
Wei H., Xue-chen D., Lei Z. Characterization of ultrafine copper powder prepared by novel electrodeposition method. Journal of Center South University Technology 2009, 16:708-712.
-
(2009)
Journal of Center South University Technology
, vol.16
, pp. 708-712
-
-
Wei, H.1
Xue-chen, D.2
Lei, Z.3
-
5
-
-
33746287444
-
Function of additives in electrolytic preparation of copper powder
-
Xu J., Wu Q., Wang Z., Yi S. Function of additives in electrolytic preparation of copper powder. Hydrometallurgy 2006, 82:154-156.
-
(2006)
Hydrometallurgy
, vol.82
, pp. 154-156
-
-
Xu, J.1
Wu, Q.2
Wang, Z.3
Yi, S.4
-
6
-
-
79251615421
-
Effect of the anode material on the composition and dimensional characteristics of the nano-sized copper-bearing powders produced by the electrochemical method
-
Tesakova M., Parfenyuk V. Effect of the anode material on the composition and dimensional characteristics of the nano-sized copper-bearing powders produced by the electrochemical method. Surface Engineering and Applied Electrochemistry 2010, 46(5):11-16.
-
(2010)
Surface Engineering and Applied Electrochemistry
, vol.46
, Issue.5
, pp. 11-16
-
-
Tesakova, M.1
Parfenyuk, V.2
-
7
-
-
84873935515
-
Effects of new additives (lanolin) on the electro-deposition of copper powder
-
Jafar S. Effects of new additives (lanolin) on the electro-deposition of copper powder. Engineering and Technology Journal 2009, 27(12):2308-2321.
-
(2009)
Engineering and Technology Journal
, vol.27
, Issue.12
, pp. 2308-2321
-
-
Jafar, S.1
-
8
-
-
79959686506
-
Characterization of nano/micro size copper powder by product of electropolishing process
-
Awad A., Abd-el Rahman A., Abdel Rafea M. Characterization of nano/micro size copper powder by product of electropolishing process. Journal of American Science 2010, 6(9):137-143.
-
(2010)
Journal of American Science
, vol.6
, Issue.9
, pp. 137-143
-
-
Awad, A.1
Abd-el Rahman, A.2
Abdel Rafea, M.3
-
9
-
-
77952293005
-
-
ASM International, Ohio
-
Lee P.W., Eisen W.B., Ferguson B.L., German R.M., Iacocca R., Madan D., Sanderow H., Hardbound Y.T. ASM Metals Handbook Powder Metallurgy 1998, vol. 7. ASM International, Ohio. 9th ed.
-
(1998)
ASM Metals Handbook Powder Metallurgy
, vol.7
-
-
Lee, P.W.1
Eisen, W.B.2
Ferguson, B.L.3
German, R.M.4
Iacocca, R.5
Madan, D.6
Sanderow, H.7
Hardbound, Y.T.8
-
11
-
-
55849111884
-
Production of copper nanoparticles by electrochemical process
-
Raja M. Production of copper nanoparticles by electrochemical process. Powder Metallurgy and Metal Ceramics 2008, 47(7-8):402-405.
-
(2008)
Powder Metallurgy and Metal Ceramics
, vol.47
, Issue.7-8
, pp. 402-405
-
-
Raja, M.1
-
12
-
-
0021616689
-
The morphology and properties of electrodeposited copper powder
-
Walker R., Duncan S. The morphology and properties of electrodeposited copper powder. Surface Technology 1984, 23:301-321.
-
(1984)
Surface Technology
, vol.23
, pp. 301-321
-
-
Walker, R.1
Duncan, S.2
-
13
-
-
70349514804
-
Influence of the interaction between chloride and thiourea on copper electrodeposition
-
Tantavichet N., Damronglerd S., Chailapakul O. Influence of the interaction between chloride and thiourea on copper electrodeposition. Electrochimica Acta 2009, 55:240-249.
-
(2009)
Electrochimica Acta
, vol.55
, pp. 240-249
-
-
Tantavichet, N.1
Damronglerd, S.2
Chailapakul, O.3
-
14
-
-
34250489431
-
The effect of chlorides on electrodeposition of powdered copper precipitates
-
Gurevich L., Pomosov A. The effect of chlorides on electrodeposition of powdered copper precipitates. Poroshkovaya Metallurgiya 1969, 1(73):13-20.
-
(1969)
Poroshkovaya Metallurgiya
, vol.1
, Issue.73
, pp. 13-20
-
-
Gurevich, L.1
Pomosov, A.2
-
15
-
-
0343438057
-
Two level factorial experimental designs based on multiple linear regression models: a tutorial digest illustrated by case studies
-
Gonzalez A. Two level factorial experimental designs based on multiple linear regression models: a tutorial digest illustrated by case studies. Analytica Chimica Acta 1998, 360:227-241.
-
(1998)
Analytica Chimica Acta
, vol.360
, pp. 227-241
-
-
Gonzalez, A.1
-
16
-
-
67949092692
-
The use of nonregular fractional factorial designs in combination toxicity studies
-
Phoa F., Xu H., Wong W. The use of nonregular fractional factorial designs in combination toxicity studies. Food and Chemical Toxicology 2009, 47:2183-2188.
-
(2009)
Food and Chemical Toxicology
, vol.47
, pp. 2183-2188
-
-
Phoa, F.1
Xu, H.2
Wong, W.3
-
17
-
-
34247544650
-
Evaluation on dispersion behavior of the aqueous copper nano-suspensions
-
Li X., Zhu D., Wang X. Evaluation on dispersion behavior of the aqueous copper nano-suspensions. Journal of Colloid and Interface Science 2007, 310:456-463.
-
(2007)
Journal of Colloid and Interface Science
, vol.310
, pp. 456-463
-
-
Li, X.1
Zhu, D.2
Wang, X.3
-
18
-
-
84855561981
-
Design of experiments study of hydroxyapatite synthesis for orthopaedic application using fractional factorial design
-
Kehoe S., Ardhaoui M., Stokes J. Design of experiments study of hydroxyapatite synthesis for orthopaedic application using fractional factorial design. Journal of Material Engineering and Performance 2011, 20:1423-1437.
-
(2011)
Journal of Material Engineering and Performance
, vol.20
, pp. 1423-1437
-
-
Kehoe, S.1
Ardhaoui, M.2
Stokes, J.3
-
19
-
-
80052484165
-
Paromomycin loaded solid lipid nanoparticles: characterization of production parameters
-
Ghadiri M., Vatanara A., Doroud D., Najafabadi A. Paromomycin loaded solid lipid nanoparticles: characterization of production parameters. Biotechnology and Bioprocess Engineering 2011, 16:617-623.
-
(2011)
Biotechnology and Bioprocess Engineering
, vol.16
, pp. 617-623
-
-
Ghadiri, M.1
Vatanara, A.2
Doroud, D.3
Najafabadi, A.4
-
20
-
-
0032526047
-
Fractional factorial designs for optimizing experimental conditions for Hiestand's Indices of Tableting Performance
-
Venkatesh G., Coleman J., Wrzosek T., Duddu S., Palepu N., Bandyopadhyay R., Grant D. Fractional factorial designs for optimizing experimental conditions for Hiestand's Indices of Tableting Performance. Powder Technology 1998, 97:151-159.
-
(1998)
Powder Technology
, vol.97
, pp. 151-159
-
-
Venkatesh, G.1
Coleman, J.2
Wrzosek, T.3
Duddu, S.4
Palepu, N.5
Bandyopadhyay, R.6
Grant, D.7
-
22
-
-
79960838967
-
Screening of factors influencing Cu(II) extraction by soybean oil-based organic solvents using fractional factorial design
-
Chang S., Teng T., Ismail N. Screening of factors influencing Cu(II) extraction by soybean oil-based organic solvents using fractional factorial design. Journal of Environmental Management 2011, 92:2580-2585.
-
(2011)
Journal of Environmental Management
, vol.92
, pp. 2580-2585
-
-
Chang, S.1
Teng, T.2
Ismail, N.3
-
23
-
-
84873884911
-
Software helps Design-Expert Software, Version 7.1
-
Stat-Ease Inc., Minneapolis, MN
-
Software helps Design-Expert Software, Version 7.1. User's guide, Technical Manual 2007, Stat-Ease Inc., Minneapolis, MN.
-
(2007)
User's guide, Technical Manual
-
-
-
24
-
-
0033743291
-
Hydrogen evolving activity on nickel-molybdenum deposits using experimental strategies
-
Hu C., Weng C. Hydrogen evolving activity on nickel-molybdenum deposits using experimental strategies. Journal of Applied Electrochemistry 2000, 30:499-506.
-
(2000)
Journal of Applied Electrochemistry
, vol.30
, pp. 499-506
-
-
Hu, C.1
Weng, C.2
-
25
-
-
33748414039
-
Morphologies of copper deposits obtained by the electrodeposition at high over potentials
-
Nikolic N., Popov K., Pavlovic Lj., Pavlovic M. Morphologies of copper deposits obtained by the electrodeposition at high over potentials. Surface and Coating Technology 2006, 201:560-566.
-
(2006)
Surface and Coating Technology
, vol.201
, pp. 560-566
-
-
Nikolic, N.1
Popov, K.2
Pavlovic, L.3
Pavlovic, M.4
-
26
-
-
44449164383
-
Morphologies of electrochemically formed copper powder particles and their dependence on the quantity of evolved hydrogen
-
Nikolic K., Pavlovic Lj., Pavlovic M., Popov N. Morphologies of electrochemically formed copper powder particles and their dependence on the quantity of evolved hydrogen. Powder Technology 2008, 185:195-201.
-
(2008)
Powder Technology
, vol.185
, pp. 195-201
-
-
Nikolic, K.1
Pavlovic, L.2
Pavlovic, M.3
Popov, N.4
-
27
-
-
0028420180
-
A microscopic investigation of electrolytic copper powder deposited by reversing currents
-
Pavlovic M., Popov K., Removic G., Komnenic V., Strbacki Z. A microscopic investigation of electrolytic copper powder deposited by reversing currents. Hydrometallurgy 1994, 35:267-274.
-
(1994)
Hydrometallurgy
, vol.35
, pp. 267-274
-
-
Pavlovic, M.1
Popov, K.2
Removic, G.3
Komnenic, V.4
Strbacki, Z.5
-
28
-
-
18344382063
-
The chemistry of the additive in an acid copper electroplating bath
-
Healy J., Pletcher D. The chemistry of the additive in an acid copper electroplating bath. Journal of Electroanalytical Chemistry 1992, 338:155-165.
-
(1992)
Journal of Electroanalytical Chemistry
, vol.338
, pp. 155-165
-
-
Healy, J.1
Pletcher, D.2
|