Production of copper nanoparticles by electrochemical process

Powder Metallurgy and Metal Ceramics

Volumn 47, Issue 7-8, 2008, Pages 402-405

  Raja, M ^a  

^a Kyung Hee University   (South Korea)

Author keywords

Copper nanoparticles; Electrodeposition; Scanning electron microscopy; Spongy layer; Transmission electron microscopy; UV VIS; XRD

Indexed keywords

AQUEOUS SOLUTIONS; CATHODE SURFACES; CONSTANT CURRENTS; COPPER NANOPARTICLES; COPPER PARTICLES; COPPER SULPHATE; DC VOLTAGES; ELECTROCHEMICAL PROCESSES; MORPHOLOGICAL CHARACTERIZATIONS; SEM AND TEM; SPONGY LAYER; UV-VIS; XRD;

ACIDS; MICROSCOPIC EXAMINATION; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; SOLUTIONS; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS;

COPPER;

EID: 55849111884     PISSN: 10681302     EISSN: 15739066     Source Type: Journal    
DOI: 10.1007/s11106-008-9034-2     Document Type: Article

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