SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 529, Issue , 2013, Pages 25-28

Effects of pressure on electroplating of copper using supercritical carbon dioxide emulsified electrolyte

(4) Chang, Tso Fu Mark a Shimizu, Tetsuya a Ishiyama, Chiemi a Sone, Masato a

a TOKYO INSTITUTE OF TECHNOLOGY (Japan)

Author keywords

Copper electroplating; Copper sulfate based electrolyte; Pressure; Supercritical carbon dioxide emulsion

Indexed keywords

CHRONOPOTENTIOMETRY; COPPER ELECTROPLATING; CRITICAL SIZE; CU FILMS; DIFFUSION LAYERS; DISPERSED PHASE; ELECTROPLATING REACTIONS; GRAIN SIZE; MINIMUM VALUE; POSITIVE POTENTIAL; SIZE AND SIZE DISTRIBUTIONS; SUPERCRITICAL CARBON DIOXIDES; SUPERCRITICAL CO; TRANSFER EFFICIENCY;

CARBON DIOXIDE; COPPER; ELECTROLYTES; EMULSIFICATION; PRESSURE; SUPERCRITICAL FLUID EXTRACTION; SURFACE ROUGHNESS;

ELECTROPLATING;

EID: 84873716188 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2012.05.058 Document Type: Conference Paper

Times cited : (39)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.