Study on the effect of temperature and pressure on nickel-electroplating characteristics in supercritical CO 2

Chemosphere

Volumn 58, Issue 4, 2005, Pages 459-465

  Kim, Moon Sun ^a   Kim, Jae Youn ^a   Kim, Chul Kyung ^b   Kim, Nam Ki ^a  

^a Sungkyunkwan University   (South Korea)

^b Mokwon University   (South Korea)

Author keywords

Nickel electroplating; Pressure; Solubility; Supercritical CO 2; Temperature

Indexed keywords

DISPERSION PROPERTIES; NICKEL FILMS; NON-POLAR MATERIALS; SUPERCRITICAL CARBON DIOXIDE;

BLOCK COPOLYMERS; CARBON DIOXIDE; CONCENTRATION (PROCESS); DISPERSIONS; ELECTRIC RESISTANCE; ELECTROPLATING; EMULSIONS; PH EFFECTS; PRESSURE EFFECTS; SOLUBILITY; SURFACE ACTIVE AGENTS; THERMAL EFFECTS;

NICKEL;

CARBON DIOXIDE; COPOLYMER; NICKEL;

ELECTROPLATING; INDUSTRIAL APPLICATION; NICKEL; PRESSURE; SOLUBILITY; SUPERCRITICAL CARBON DIOXIDE; TEMPERATURE EFFECT;

ARTICLE; COATED PARTICLE; CONCENTRATION (PARAMETERS); ELECTRIC RESISTANCE; ELECTROPLATING INDUSTRY; MATERIAL COATING; MOLECULAR STABILITY; PH MEASUREMENT; SUPERCRITICAL FLUID; TEMPERATURE DEPENDENCE;

ABSORPTION; CARBON DIOXIDE; ELECTROPLATING; HYDROGEN-ION CONCENTRATION; NICKEL; PRESSURE; REFUSE DISPOSAL; SOLUBILITY; SURFACE-ACTIVE AGENTS; TEMPERATURE; TIME FACTORS;

EID: 11144343212     PISSN: 00456535     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.chemosphere.2004.09.030     Document Type: Article

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