Thermal behavior and dielectric property analysis of boron nitride-filled bismaleimide-triazine resin composites

Journal of Applied Polymer Science

Volumn 128, Issue 3, 2013, Pages 1353-1359

  Zeng, Xiaoliang ^a   Yu, Shuhui ^a   Sun, Rong ^a  

^a SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY   (China)

Author keywords

composites; dielectric properties; thermal properties; thermosets

Indexed keywords

BISMALEIMIDE-TRIAZINE RESIN; BT RESINS; ELECTRONIC PACKAGING; LOSS TANGENT; STRUCTURE PROPERTY RELATIONSHIPS; THERMAL AND DIELECTRIC PROPERTIES; THERMAL BEHAVIORS; THERMAL DECOMPOSITION TEMPERATURE;

BORON NITRIDE; COMPOSITE MATERIALS; DECOMPOSITION; DIELECTRIC PROPERTIES; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRONICS PACKAGING; RESINS; THERMODYNAMIC PROPERTIES; THERMOSETS;

THERMAL CONDUCTIVITY;

EID: 84873710525     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.38276     Document Type: Article

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