Dynamic mechanical properties of aluminum nitride/cyanate ester composites for high performance electronic packaging

Polymers for Advanced Technologies

Volumn 21, Issue 5, 2010, Pages 365-370

  Linga, Wei ^a   Gua, Aijuan ^a   Lianga, Guozheng ^a   Yuana, Li ^a   Liua, Jie ^a  

^a Department of Polymer Science and Engineering   (China)

Author keywords

Aluminum nitride; Composites; Cyanate ester; Dynamic mechanical analysis

Indexed keywords

ALN; COMPOSITES; CYANATE ESTER; CYANATE ESTERS; DAMPING FACTORS; DYNAMIC MECHANICAL PROPERTY; ELECTRONIC PACKAGING; ESTER COMPOSITES; KEY FEATURE; LOSS MODULI; ON DYNAMICS; POLYMERIC COMPOSITES; STORAGE MODULI; STRUCTURE PROPERTY RELATIONSHIPS;

ALUMINUM; ALUMINUM NITRIDE; DYNAMIC ANALYSIS; DYNAMICS; ELECTRONICS PACKAGING; ENERGY DISSIPATION; ESTERIFICATION; ESTERS; MECHANICAL PROPERTIES; NITRIDES; RESINS;

DYNAMIC MECHANICAL ANALYSIS;

COMPOSITE; MECHANICAL PROPERTY; METAL; STRUCTURAL ANALYSIS; STRUCTURAL PROPERTY; SYNTHETIC RESIN; VISCOELASTICITY;

EID: 77954445352     PISSN: 10427147     EISSN: 10991581     Source Type: Journal    
DOI: 10.1002/pat.1436     Document Type: Article

References (23)

1. O. Pankow, S. N. Gudrun, Macromol. Mater. Eng. 2004, 289, 990-996.
2. Y. P. Mamunya, M. V. Iurzhenko, E. V. Lebedev, S. S. Ischenko, G. Boiteux, G. Seytre, J. Non-Cryst. Solids 2007, 353, 4288-4292.
3. P. G. Ren, G. Z. Liang, Z. P. Zhang, T. Lu, Comp. Part A 2006, 37, 46-53.
4. W. Zhang, R. S. Blackburn, A. Dehghani, J. Mater. Sci. 2007, 42, 7861-7865.
5. Z. M. Elimat, A. M. Zihlif, G. Ragosta, J. Mater. Sci. Mater. Electron. 2008, 19, 1035-1038.
6. L. Liu, A. J. Gu, Z. P. Fang, Comp. A 2007, 38, 1957-1964.
7. A. J. Gu, G. Z. Liang, M. Ni, D. Liang, Polym. Adv. Tech. 2007, 18, 835-840.
8. J. D. Ferry, Viscoelastic Properties of Polymers, (3rd edn), John Wiley & Sons, New York 1980.
9. S. N. Goyanes, P. G. Konig, J. D. Marconi, J. Appl. Polym. Sci. 2003, 88, 883-892.
10. P. L. Teh, M. Jaafar, H. M. Akil, K. N. Seetharamu, A. N. R. Wagiman, K. S. Beh, Polym. Adv. Tech. 2008, 19, 308-315.
11. C. Z. Yang, A. J. Gu, H. W. Song, Z. B. Xu, Z. P. Fang, L. F. Tong, J. Appl. Polym. Sci. 2007, 105, 2020-2026.
12. K. C. Yung, B. L. Zhu, J. Wu, T. M. Yue, C. S. Xie, J. Polym. Sci. Part B 2007, 45, 1662-1674.
13. H. S. Kim, Y. S. Chae, B. H. Park, J. S. Yoon, M. S. Kang, H. J. Jin, Curr. Appl. Phys. 2008, 8, 803-806.
14. Z. Han, J. W. Wood, H. Herman, C. Zhang, G. C. Stevens, 2008 IEEE International Symposium on Electrical Insulation, 2008, 497-501.
15. P. Bujard, G. Kuhnlein, S. Ino, T. Shiobara, IEEE Trans. Compon. Hybrids Manuf. Technol. Part A 1994, 17, 527-532.
16. J. J. Wang, X. S. Yi, J. Appl. Polym. Sci. 2003, 89, 3913-3917.
17. Y. Xu, D. D. L. Chung, C. Mroz, Comp. A 2001, 32A, 1749-1757.
18. G. W. Lee, M. Park, J. Y. Kim, J. I. Lee, H. G. Yoon, Comp. A 2006, 37, 727-734.
19. S. Konzelmann, C. Hoffmann, R. Merte, D. Peier, Dielectr. Electr. Insul. 2008, 15, 327-333.
20. K. C. Yung, J. Wu, T. M. Yue, C. S. Xie, J. Comp. Mater. 2006, 40, 567-581.
21. A. J. Gu, Comp. Sci. Tech. 2006, 66, 1749-1755.
22. J. L. Wang, G. Z. Liang, W. Zhao, Polym. Eng. Sci. 2006, 46, 581-587.
23. I. Hamerton, Chem. Ind. 1995, 21, 887.