Microstructural development and mechanical properties of nanostructured copper reinforced with SiC nanoparticles

Materials Science and Engineering: A

Volumn 568, Issue , 2013, Pages 33-39

  Akbarpour, M R ^a   Salahi, E ^a   Hesari, F Alikhani ^a   Yoon, E Y ^b   Kim, H S ^b   Simchi, A ^c  

^a MATERIALS AND ENERGY RESEARCH CENTER   (Iran)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

^c SHARIF UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

Copper; Grain size; Nanocomposites; Nanostructured materials; SiC; Strengthening mechanism

Indexed keywords

COMPRESSION TESTING; COPPER; DYNAMIC RECRYSTALLIZATION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HOT PRESSING; MECHANICAL ALLOYING; MECHANISMS; METALLIC MATRIX COMPOSITES; MICROSTRUCTURAL EVOLUTION; NANOPARTICLES; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; STRENGTHENING (METAL); TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

FABRICATION PROCESS; GRAINSIZE; HIGH ANGLE GRAIN BOUNDARIES; HIGH-ENERGY MECHANICAL MILLING; MICROSTRUCTURAL DEVELOPMENT; MICROSTRUCTURE DEVELOPMENT; NANOSTRUCTURED COPPER; NANOSTRUCTURED CU; SIC NANOPARTICLES; STRENGTHENING MECHANISMS;

NANOCOMPOSITES;

EID: 84873434087     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2013.01.010     Document Type: Article

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