Performance and characterization of dispersion strengthened Cu-TiB 2 composite for electrical use

Materials Characterization

Volumn 55, Issue 4-5, 2005, Pages 252-262

  Lopez M ^a   Corredor, D ^a   Camurri, C ^a   Vergara, V ^a   Jimenez J ^b  

^a UNIVERSITY OF CONCEPCIÓN   (Chile)

^b CENTRO DE INVESTIGACIONES BIOLÓGICAS   (Spain)

Author keywords

Copper ceramic alloy; Hot pressing; Mechanical alloying; Properties

Indexed keywords

CHARACTERIZATION; CONSOLIDATION; COPPER COMPOUNDS; DISPERSIONS; ELECTRIC CONDUCTIVITY; HOT ISOSTATIC PRESSING; MECHANICAL ALLOYING; MICROSTRUCTURE; POWDER METALLURGY; RAPID THERMAL ANNEALING; SYNTHESIS (CHEMICAL);

COPPER-CERAMIC ALLOYS; PROPERTIES;

COMPOSITE MATERIALS;

EID: 27644468678     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2005.04.006     Document Type: Article

References (10)

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