Microstructure and performance of electroformed Cu/nano-SiC composite

Materials and Design

Volumn 28, Issue 6, 2007, Pages 1958-1962

  Zhu, Jianhua ^a   Liu, Lei ^a   Zhao, Haijun ^a   Shen, Bin ^a   Hu, Wenbin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; ELECTRIC CONDUCTIVITY; ELECTROFORMING; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; NANOPARTICLES; SILICON CARBIDE; SURFACE MORPHOLOGY; WEAR RESISTANCE;

NANOSIZED-SILICON CARBIDE; PARTICLE REINFORCED COMPOSITE;

METALLIC MATRIX COMPOSITES;

COPPER ALLOYS; ELECTRIC CONDUCTIVITY; ELECTROFORMING; METALLIC MATRIX COMPOSITES; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; NANOPARTICLES; SILICON CARBIDE; SURFACE MORPHOLOGY; WEAR RESISTANCE;

EID: 34249672347     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2006.04.021     Document Type: Article

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