The effect of SiO2 filler content and its organic compatibility on thermal stability of epoxy resin

Journal of Thermal Analysis and Calorimetry

Volumn 111, Issue 1, 2013, Pages 247-252

  Afzal, Adeel ^a,c   Siddiqi, Humaira M ^a   Iqbal, Naseer ^a   Ahmad, Zahoor ^b  

^a QUAID I AZAM UNIVERSITY   (Pakistan)

^b KUWAIT UNIVERSITY   (Kuwait)

^c UNIVERSITY OF BARI   (Italy)

Author keywords

Bicontinuous nanocomposite; Epoxy networks; Glass transition; Sol gel; Thermal stability; Thermogravimetry

Indexed keywords

BICONTINUOUS; DECOMPOSITION TEMPERATURE; EPOXY NETWORK; EPOXY-SILICA NANOCOMPOSITES; FILLER CONTENTS; KINETIC STUDY; ORGANIC-INORGANIC; PRISTINE EPOXY; SILICA PHASIS; THERMOGRAVIMETRIC; TWO-STAGE POLYMERIZATION;

ACTIVATION ENERGY; COUPLING AGENTS; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FILLERS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; POLYMERIZATION; SILANES; SILICA; SOL-GELS; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

NANOCOMPOSITES;

EID: 84872496754     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-012-2267-9     Document Type: Article

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