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Volumn 72, Issue 2, 2003, Pages 421-429

Thermal behaviour of a polyhedral oligomeric silsesquioxane with epoxy resin cured by diamines

Author keywords

Differential scanning calorimetry; Epoxy systems; Glycidylisobutyl POSS; Polyhedral oligomeric silsesquioxanes

Indexed keywords

ATOMIC FORCE MICROSCOPY; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; ISOTHERMS; MECHANICAL PROPERTIES; SILICON; THERMOGRAVIMETRIC ANALYSIS;

EID: 0037590680     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024544709249     Document Type: Article
Times cited : (32)

References (18)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.