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Volumn 72, Issue 2, 2003, Pages 421-429
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Thermal behaviour of a polyhedral oligomeric silsesquioxane with epoxy resin cured by diamines
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Author keywords
Differential scanning calorimetry; Epoxy systems; Glycidylisobutyl POSS; Polyhedral oligomeric silsesquioxanes
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
DIFFERENTIAL SCANNING CALORIMETRY;
EPOXY RESINS;
ISOTHERMS;
MECHANICAL PROPERTIES;
SILICON;
THERMOGRAVIMETRIC ANALYSIS;
DYNAMIC MODES;
OLIGOMERS;
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EID: 0037590680
PISSN: 13886150
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1024544709249 Document Type: Article |
Times cited : (32)
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References (18)
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