Organic/inorganic hybrid materials from an epoxy resin cured by an amine silsesquioxane

Journal of Thermal Analysis and Calorimetry

Volumn 87, Issue 1, 2007, Pages 69-72

  Ramírez, Carmen ^a   Rico, M ^a   Barral, L ^a   Diez J ^a   Garcia Garabal S ^a   Montero, B ^a  

^a Grupo de Polímeros   (Spain)

Author keywords

Cure kinetics; Iso conversional model; Silsesquioxanes; Thermal degradation

Indexed keywords

ACTIVATION ENERGY; AMINES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; POLYMERIZATION; PYROLYSIS; THERMOGRAVIMETRIC ANALYSIS;

CURE KINETICS; ISO CONVERSIONAL MODELS; SILSESQUIOXANES;

EPOXY RESINS;

EID: 33846853953     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-006-7815-8     Document Type: Conference Paper

References (13)

1. R. B. Prime, Thermal characterization of polymeric materials. Academic Press, New York 1997, p. 1380.
2. A. Cadenato, J. M. Morancho, X. Fernández-Francos, J. M. Salla and X. Ramis, J. Therm. Anal. Cal., in press (2006).
3. S. H. Phillips, M. S. Haddad and S. J. Tomczak, Curr. Opin. Solid State Mater. Sci., 8 (2004) 21.
4. Y. Ni, S. Zheng and K. Nie, Polymer, 45 (2004) 5557.
5. A. Lee and J. D. Lichtenhan, Macromol., 31 (1998) 4970.
6. C. Ramirez, M. Rico, J. M. L. Vilariño, L. Barral, M. Ladra and B. Montero, J. Therm. Anal. Cal., 80 (2005) 153.
7. M. G. Lu, H-K. Choi, H-K. Lee, M-J. Shim and S. W. Kim. Polym. J., 33 (2001) 49.
8. C. Ramírez, M. Rico, J. López, B. Montero and R. Montes, J. Appl. Polym. Sci., in press (2006).
9. M. E. Brown, Introduction to thermal analysis: techniques and applications. Chapman & Hall, Cambridge 1988, p. 134.
10. M. J. Abad, L. Barral, D. F. Fasce and R. J. J. Williams, Macromol., 36 (2003) 3128.
11. M.L. Marin, A. Jiménez, J. López and J. Vilaplana, J. Thermal Anal., 47 (1996) 247.
12. J. T. Sun, Y. D. Huang, G. T. Gong and H. L. Cao, Polym. Degrad. Stab., 91 (2006) 339.
13. Standard test method for Arrhenius kinetic constant for thermally unstable materials (ANSI/ASTM E698-79) ASTM: Philadelphia, PA, 1979.