Effect of heat treatment on the deformation and fracture behaviors of 3-ply Cu/Al/Cu clad metal

Journal of Korean Institute of Metals and Materials

Volumn 50, Issue 12, 2012, Pages 939-948

  Kim, In Kyu ^a   Ha, Jongsu ^a   Hong, Sun Ig ^a  

^a Chungnam National University   (South Korea)

Author keywords

Aluminum; Clad; Copper; Heat treatment; Interfacial fracture

Indexed keywords

BONDING PROCESS; CLAD; CU LAYERS; DEFORMATION AND FRACTURE; INTERFACIAL FRACTURE; INTERFACIAL REACTION LAYER; INTERMETALLIC LAYER; MICROSCOPIC OBSERVATIONS; MICROSTRUCTURES AND MECHANICAL PROPERTIES; PARALLEL CRACK; PREMATURE FRACTURE; REACTION LAYERS; STRAIN CONCENTRATION; STRESS AXIS; VERTICAL CRACK;

ALUMINUM; COPPER; CRACKS; DELAMINATION; DUCTILITY; FRACTURE; HEAT TREATMENT; ROLL BONDING; STRESS-STRAIN CURVES; TENSILE TESTING;

CLAD METALS;

EID: 84872463359     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: 10.3365/KJMM.2012.50.12.939     Document Type: Article

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