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Volumn 44, Issue 10, 2001, Pages 2509-2515
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Microstructure and conductivity of Cu-Nb microcomposites fabricated by the bundling and drawing process
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Author keywords
Cold working; Composite; Electrical properties; Microstructure
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Indexed keywords
COLD WORKING;
COPPER;
ELECTRIC CONDUCTIVITY OF SOLIDS;
ELECTRON SCATTERING;
HIGH TEMPERATURE EFFECTS;
INTERFACES (MATERIALS);
METAL DRAWING;
METALLOGRAPHIC MICROSTRUCTURE;
NIOBIUM;
PRECIPITATION (CHEMICAL);
TRANSMISSION ELECTRON MICROSCOPY;
BUNDLING;
MICROCOMPOSITES;
RESISTIVITY RATIO;
SPHEROIDIZATION;
COMPOSITE MATERIALS;
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EID: 0035946849
PISSN: 13596462
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6462(01)00665-0 Document Type: Article |
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Times cited : (56)
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References (21)
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