A novel approach to separation of waste printed circuit boards using dimethyl sulfoxide

International Journal of Environmental Science and Technology

Volumn 10, Issue 1, 2013, Pages 175-180

  Zhu, P ^a   Chen, Y ^a   Wang, L Y ^a   Qian, G R ^a   Zhou, M ^b   Zhou, J ^c  

^a SHANGHAI UNIVERSITY   (China)

^b SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION   (China)

^c PEKING UNIVERSITY   (China)

Author keywords

Delamination; Dimethyl sulfoxide; Dissolution; Separation; Waste printed circuit boards

Indexed keywords

DELAMINATION; DIMETHYL SULFOXIDE; DISSOLUTION; ELECTRIC NETWORK ANALYSIS; ENVIRONMENTAL TECHNOLOGY; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS FIBERS; METAL RECOVERY; SEPARATION; SOLVENTS; THERMOANALYSIS; TIMING CIRCUITS;

ELECTRONIC COMPONENT; ENVIRONMENTAL-FRIENDLY; HETEROGENEOUS MIXTURES; HIGH-EFFICIENCY; INNOVATIVE TECHNOLOGY; METALLOGRAPHIC MICROSCOPE; ORGANIC MATERIALS; WASTE PRINTED CIRCUIT BOARD;

PRINTED CIRCUIT BOARDS;

EID: 84871975754     PISSN: 17351472     EISSN: 17352630     Source Type: Journal    
DOI: 10.1007/s13762-012-0124-9     Document Type: Article

References (19)

1. Chen XR, Zhang HY, Tian XY (2000) DMSO application development prospects. Chem Ind Eng Prog 1: 53-56.
2. Chuan-jin G et al (2011) Study on recycling of non-metal material of different types of waste printed circuit boards. J Shanghai Second Polytech Univ 28(3): 223-229.
3. Dean JA (1991) Lange's chemistry handbook. Science Press, Beijing, p 918 (Chinese Version 13th).
4. Gu WX, Huan C, Yang C, Zhu P, Li CH (2008) Recovery of aurum from waste printed circuit boards. Environ Sci Technol 31: 98-100.
5. Guo JY, Guo J, Xu ZM (2009) Recycling of non-metallic fractions from waste printed circuit boards: a review. J Hazard Mater 168: 567-590.
6. Guo QJ, Yue XH, Wang MH, Liu YZ (2010) Pyrolysis of scrap printed circuit board plastic particles in a fluidized bed. Powder Technol 198: 422-428.
7. Havlik T, Orac D, Petranikova M, Miskufova A, Kukurugya F, Takacova Z (2010) Leaching of copper and tin from used printed circuit boards after thermal treatment. J Hazard Mater 183: 866-873.
8. Havlik T, Orac D, Petranikova M, Miskufo A (2011) Hydrometallurgical treatment of used printed circuit boards after thermal treatment. Waste Manag (Oxford) 31: 1542-1546.
9. Kim EY, Kim MS, Lee JC, Yoo KK, Jeong JK (2010) Leaching behavior of copper using electro-generated chlorine in hydrochloric acid solution. Hydrometallurgy 100: 95-102.
10. Kim EY, Kim MS, Lee JC, Jeong JK, Pandey BD (2011) Leaching kinetics of copper from waste printed circuit boards by electro-generated chlorine in HCl solution. Hydrometallurgy 107: 124-132.
11. Kinoshita T, Akita S, Kobayashi N et al (2003) Metal recovery from non-mounted printed wiring boards via hydrometallurgical processing. Hydrometallurgy 69(1-3): 73-79.
12. Ma L, Li T (2010) Recovery of epoxy resin in waste printed circuit boards by solvent method. J Kunming Univ Sci Technol (Sci Technol) 35(4): 85-88.
13. Nusruth M, Philip H, Nicholas M (2007) Investigating the use of vertical vibration to recover metal from electrical and electronic waste. Miner Eng 20: 926-932.
14. Oishi T, Koyama K, Alam S, Tanaka M, Lee J-C (2007) Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions. Hydrometallurgy 89: 82-88.
15. Östlund Å, Lundberg D, Nordstierna L, Holmberg K, Nydén M (2009) Dissolution and gelation of cellulose in TBAF/DMSO solutions: the roles of fluoride ions and water. Biomacromolecules 10(9): 2401-2407.
16. Prafulla C, Narendra Nath D, Neelotpal Sen S (2008) Development of a catalyst for solution of poly(vinylalcohol) in non-aqueous medium. Chin J Polym Sci 26: 399-404.
17. Yaun TQ, He J, Xu F, Sun RC (2010) A new vision in the research of biomass resources: complete-lignocellulose-dissolution system. Prog Chem 22: 471-481.
18. Zhu P, Gu GB (2002) Recovery of gold and copper from waste printed circuits. Chin J Rare Met 26: 214-216.
19. Zhu P, Fan ZY, Lin J, Liu Q, Qian GR, Zhou M (2009) Enhancement of leaching copper by electro-oxidation from metal powders of waste printed circuit board. J Hazard Mater 309: 746-750.