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Volumn 183, Issue 1-3, 2010, Pages 866-873

Leaching of copper and tin from used printed circuit boards after thermal treatment

Author keywords

Burning; Leaching; Printed circuit boards; Pyrolysis; WEEE

Indexed keywords

BURNING; BURNING TEMPERATURE; COPPER EXTRACTION; LEACHING SOLUTION; ORIGINAL SAMPLE; PYROLYSIS TEMPERATURE; TEMPERATURE RANGE; THERMAL PRE-TREATMENT; THERMAL TREATMENT; WEEE; WEIGHT LOSS;

EID: 77956446598     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2010.07.107     Document Type: Article
Times cited : (158)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.