Toughening effect of Ni on nc-CrAlN/a-SiN x hard nanocomposite

Applied Surface Science

Volumn 265, Issue , 2013, Pages 418-423

  Wang, Yu Xi ^a   Zhang, Sam ^a   Lee, Jyh Wei ^b   Lew, Wen Siang ^c   Li, Bo ^d  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d CENTRAL IRON AND STEEL RESEARCH INSTITUTE   (China)

Author keywords

Magnetron sputtering; Nanocomposite; Nickel; Toughness

Indexed keywords

FIELD EMISSION MICROSCOPES; FRACTURE MECHANICS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MAGNETRON SPUTTERING; NANOCOMPOSITES; NANOCRYSTALS; NICKEL; SCANNING ELECTRON MICROSCOPY; TOUGHNESS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

FIELD EMISSION SCANNING ELECTRON MICROSCOPY; GLANCING ANGLE; GRAIN SIZE; MORPHOLOGY CHANGES; NANOCRYSTALLINES; NI CONTENT; TOUGHENING EFFECTS; X-RAY AMORPHOUS;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 84871930569     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2012.11.022     Document Type: Article

References (21)

1. S. Veprek, and S. Reiprich Thin Solid Films 268 1995 64 71
2. S. Veprek, and M.J.G. Veprek-Heijman Surface and Coatings Technology 202 2008 5063 5073
3. S. Zhang, H.L. Wang, S.E. Ong, D. Sun, and X.L. Bui Plasma Processes and Polymers 4 2007 219 228
4. A.D. Pogrebnjak, A.P. Shpak, N.A. Azarenkov, and V.M. Beresnev Physics-Uspekhi 52 2009 29 54
5. S. Zhang, D. Sun, Y. Fu, and H. Du Surface and Coatings Technology 198 2005 2 8
6. Y.X. Wang, S. Zhang, J.W. Lee, W.S. Lew, D. Sun, and B. Li Surface and Coatings Technology 2012 10.1016/j.surfcoat.2012.03.036
7. Y.X. Wang, S. Zhang, J.-W. Lee, W.S. Lew, D. Sun, and B. Li Nanoscience and Nanotechnology Letters 4 2012 375 377
8. H.-W. Chen, Y.-C. Chan, J.-W. Lee, and J.-G. Duh Surface and Coatings Technology 205 2010 1189 1194
9. J.H. Hsieh, P.C. Liu, C. Li, M.K. Cheng, and S.Y. Chang Surface and Coatings Technology 202 2008 5530 5534
10. M. Jirout, and J. Musil Surface and Coatings Technology 200 2006 6792 6800
11. S. Zhang, D. Sun, Y. Fu, Y.T. Pei, and J.T.M. De Hosson Surface and Coatings Technology 200 2005 1530 1534
12. S. Zhang, and X. Zhang Thin Solid Films 520 2012 2375 2389
13. S. Zhang, D. Sun, Y. Fu, and H. Du Thin Solid Films 447-448 2004 462 467
14. J. Soldan, J. Neidhardt, B. Sartory, R. Kaindl, R. Cerstvy, P.H. Mayrhofer, R. Tessadri, P. Polcik, M. Lechthaler, and C. Mitterer Surface and Coatings Technology 202 2008 3555 3562
15. X.-Z. Ding, X.T. Zeng, and Y.C. Liu Thin Solid Films 519 2011 1894 1900
16. K.P. Budna, P.H. Mayrhofer, J. Neidhardt, E. Hegedus, I. Kovacs, L. Toth, B. Pecz, and C. Mitterer Surface and Coatings Technology 202 2008 3088 3093
17. Y. Wang, Z.K. Liu, and L.Q. Chen Acta Materialia 52 2004 2665 2671
18. P. Nash, and O. Kleppa Journal of Alloys and Compounds 321 2001 228 231
19. A. Akbari, J.P. Riviere, C. Templier, and E. Le Bourhis Surface and Coatings Technology 200 2006 6298 6302
20. S. Veprek, and M.G.J. Veprek-Heijman Surface and Coatings Technology 201 2007 6064 6070
21. A.P. Grosvenor, M.C. Biesinger, R.S.C. Smart, and N.S. McIntyre Surface Science 600 2006 1771 1779