Silicon-embedded receiving coil for high-efficiency wireless power transfer to implantable biomedical ics

IEEE Electron Device Letters

Volumn 34, Issue 1, 2013, Pages 9-11

  Wu, Rongxiang ^a,b   Raju, Salahuddin ^a   Chan, Mansun ^a   Sin, Johnny K O ^a   Yue, C Patrick ^a,c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA   (China)

^c University of California   (United States)

Author keywords

Implantable biomedical devices; monolithic inductors; wireless power transfer

Indexed keywords

CHIP SIZES; IMPLANTABLE BIOMEDICAL DEVICES; MEASUREMENT RESULTS; MONOLITHIC INDUCTORS; PEAK EFFICIENCY; PEAK VOLTAGE; POWER LINKS; QUALITY FACTORS; RECEIVING COIL; SEPARATION DISTANCES; TRANSMITTING COILS; WIRELESS POWER TRANSFER; WIRELESS POWER TRANSMISSION;

SILICON;

EFFICIENCY;

EID: 84871746646     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2012.2225135     Document Type: Article

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