Inductive power link for a wireless cortical implant with biocompatible packaging

Proceedings of IEEE Sensors

Volumn , Issue , 2010, Pages 94-98

  Silay, Kanber Mithat ^a   Dehollain, Catherine ^a   Declercq, Michel ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBLE MATERIALS; BIOCOMPATIBLE PACKAGING; CLASS-E POWER AMPLIFIERS; CLOSED LOOP POWER CONTROL; INDUCTIVE LINK; LOAD POWER; MATCHING NETWORKS; NOMINAL LOADS; PARYLENE C; POWER EFFICIENCY; POWER LINKS; SCALP THICKNESS; SECONDARY COILS; SHORT DISTANCES; SUPPLY VOLTAGES;

BIOLOGICAL MATERIALS; POWER AMPLIFIERS; SENSORS;

ELECTRIC RECTIFIERS;

EID: 79951882481     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2010.5690844     Document Type: Conference Paper

References (14)

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