Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS

Volumn , Issue , 2012, Pages 3886-3889

  Schuettler, Martin ^a   Kohler, Fabian ^a   Ordonez, Juan S ^a   Stieglitz, Thomas ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA CERAMIC; BRAIN TISSUE; CERAMIC PACKAGE; ELECTRONIC CIRCUITRY; ELECTRONIC PACKAGING; HERMETIC PACKAGES; INFRARED COMMUNICATION; MEDICAL GRADES; OPTICAL DATA; TRANSCUTANEOUS;

ALUMINA; ELECTRONICS PACKAGING; SILICONES;

CERAMIC MATERIALS;

DIMETICONE; SILICONE DERIVATIVE;

ADHESION; ARTICLE; BRAIN; CHEMISTRY; COMPUTER INTERFACE; ELECTRODE IMPLANT; ELECTRONICS; HISTOLOGY; HUMAN; INFRARED RADIATION; INTERPERSONAL COMMUNICATION; PACKAGING; PHYSIOLOGY; SKIN;

ADHESIVENESS; BRAIN; COMMUNICATION; DIMETHYLPOLYSILOXANES; ELECTRODES, IMPLANTED; ELECTRONICS, MEDICAL; HUMANS; INFRARED RAYS; PRODUCT PACKAGING; SILICONES; SKIN; USER-COMPUTER INTERFACE;

EID: 84870786602     PISSN: 1557170X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMBC.2012.6346816     Document Type: Conference Paper

References (9)

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