Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs

2010 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC'10

Volumn , Issue , 2010, Pages 1585-1588

  Schuettler, Martin ^a   Ordonez, Juan S ^a   Santisteban, Tomas Silva ^a   Schatz, Andreas ^a   Wilde, Juergen ^b   Stieglitz, Thomas ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b IMTEK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC SUBSTRATES; ELECTRICAL PROPERTY; FABRICATION TECHNOLOGIES; HERMETIC PACKAGES; LEAK TESTS; LEAKAGE RATES; WATER VAPOUR;

FABRICATION; HELIUM; MATHEMATICAL MODELS; PACKAGING;

ELECTRIC PROPERTIES;

ARTICLE; ELECTRICITY; ELECTRONICS; EQUIPMENT; EQUIPMENT DESIGN; EQUIPMENT FAILURE; HUMIDITY; PACKAGING; PROSTHESES AND ORTHOSES;

ELECTRIC WIRING; ELECTRONICS, MEDICAL; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HUMIDITY; MINIATURIZATION; PRODUCT PACKAGING; PROSTHESES AND IMPLANTS;

EID: 78650826153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2010.5626677     Document Type: Conference Paper

References (8)

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