Fracture mechanical analysis of cracks in polymer encapsulated metal structures

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 203-208

  Wittler, Olaf ^a   Sprafke, Peter ^a   Auersperg, Jürgen ^b,c   Michel, Bernd ^c   Reichl, Herbert ^c  

^a ROBERT BOSCH GMBH   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; DELAMINATION; ENCAPSULATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; POLYMERS; STRESS ANALYSIS; THERMAL STRESS;

POLYMERIC PACKAGING;

ELECTRONICS PACKAGING;

EID: 0035791525     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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