SCOPUS 정보 검색 플랫폼

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2011, Pages 164-169

Photon emission spectra through silicon of various thicknesses

(6) Glowacki, Arkadiusz a Pagano, Carlo a Boit, Christian a Yokoyama, Yoshiyuki b Jankowski, Arkadiusz c Perdu, Philippe d

a TECHNISCHE UNIVERSITÄT BERLIN (Germany)

b Hamamatsu Photonics Germany ^* (Germany)

c LODZ UNIVERSITY OF TECHNOLOGY (Poland)

d CNES (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL FIELD; ELECTRON HOLE PAIRS; FREE CARRIERS; MATERIAL REMOVAL; MECHANICAL GRINDING; MOSFETS; PHOTON EMISSION MICROSCOPY; PHOTON EMISSIONS; SILICON LAYER; SILICON SUBSTRATES; SUBSTRATE MATERIAL; VISIBLE AND NEAR INFRARED;

ELECTROLUMINESCENCE; EMISSION SPECTROSCOPY; FAILURE ANALYSIS; LIGHT; MOSFET DEVICES; PHOTONS;

SILICON;

EID: 84869749154 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (7)

References (7)

1
- 0023382681
- A study of photon emission from n-channel MOSFETs
- A. Toriumi, M. Yoshimi, M. Iwase, Y. Akiyama, K. Taniguchi, "A study of photon emission from n-channel MOSFETs," IEEE Trans. Electron Devices ED-34, 1501 (1987)
- IEEE Trans. Electron Devices ED-34, 1501 (1987)
- Toriumi, A.¹ Yoshimi, M.² Iwase, M.³ Akiyama, Y.⁴ Taniguchi, K.⁵

2
- 0002427589
- Quantitative emission microscopy
- J. Kölzer, C. Boit, A. Dallmann, G. Deboy, J. Otto, D. Weinmann, "Quantitative emission microscopy," J. Appl. Phys. 71 (11), 1992
- (1992) J. Appl. Phys. , vol.71 , Issue.11
- Kölzer, J.¹ Boit, C.² Dallmann, A.³ Deboy, G.⁴ Otto, J.⁵ Weinmann, D.⁶

3
- 33847637090
- Functional IC Analysis Through Chip Backside with Nano Scale Resolution - E-Beam Probing in FIB Trenches to STI Level
- R. Schlangen, R. Leihkauf, U. Kerst, C. Boit, "Functional IC Analysis Through Chip Backside With Nano Scale Resolution - E-Beam Probing in FIB Trenches to STI Level", Proc. ISTFA 2006, pages 376-381
- Proc. ISTFA 2006 , pp. 376-381
- Schlangen, R.¹ Leihkauf, R.² Kerst, U.³ Boit, C.⁴

4
- 79952355157
- Improvement of optical resolution through chip backside using FIB trenches
- A. Glowacki, C. Helfmeier, U. Kerst, C. Boit, "Improvement of optical resolution through chip backside using FIB trenches", Proc. ASM/EDFAS 36th International Symposium for Testing and Failure Analysis (ISTFA), Dallas TX, USA, pp. 176-180 (2010)
- (2010) Proc. ASM/EDFAS 36th International Symposium for Testing and Failure Analysis (ISTFA), Dallas TX, USA , pp. 176-180
- Glowacki, A.¹ Helfmeier, C.² Kerst, U.³ Boit, C.⁴

5
- 0029306789
- Optical properties of intrinsic silicon at 300 K
- M. A. Green, M. J. Keevers, "Optical properties of intrinsic silicon at 300 K", Progress in Photovoltaics: Research and Applications, Vol. 3, pp. 189-192 (1995)
- (1995) Progress in Photovoltaics: Research and Applications , vol.3 , pp. 189-192
- Green, M.A.¹ Keevers, M.J.²

6
- 0000920502
- Optical absorption in heavily doped silicon
- P. E. Schmid, "Optical absorption in heavily doped silicon", Phys. Rev. B, 23, pp. 5531-5536 (1981)
- (1981) Phys. Rev. B , vol.23 , pp. 5531-5536
- Schmid, P.E.¹

7
- 0003847711
- University of New South Wales
- M. A. Green, Silicon Solar Cells: Advanced Principles & Practice, pp.46-48, University of New South Wales, 1995
- (1995) Silicon Solar Cells: Advanced Principles & Practice , pp. 46-48
- Green, M.A.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.