A highly efficient electrically pumped optical amplifier integrated on a SOI waveguide circuit

IEEE International Conference on Group IV Photonics GFP

Volumn , Issue , 2012, Pages 222-224

  Keyvaninia, S ^a   Roelkens, G ^a   Van Thourhout, D ^a   Duan, G H ^b   Lamponi, M ^b   Lelarge, F ^b   Fedeli, J M ^c   Messaoudene, S ^c   Geluk, E J ^d   Smalbrugge, B ^d  

^a GHENT UNIVERSITY   (Belgium)

^b NOKIA RESEARCH CENTER   (United States)

^c CEA LETI   (France)

^d EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

adhesive bonding; heterogeneous integration; III V on silicon amplifier

Indexed keywords

ACTIVE WAVEGUIDES; ADHESIVE BONDING; BONDING PROCESS; DRIVE CURRENTS; ELECTRICALLY PUMPED; HETEROGENEOUS INTEGRATION; HIGH CONFINEMENT; LOW-POWER CONSUMPTION; NOVEL DESIGN; ON CHIPS; ROOM TEMPERATURE; SOI WAVEGUIDES; ULTRA-THIN;

LIGHT AMPLIFIERS; OPTICAL SWITCHES; SILICON; WAVEGUIDES;

PHOTONICS;

EID: 84869161571     PISSN: 19492081     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/GROUP4.2012.6324140     Document Type: Conference Paper

References (5)

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2. G. Roelkens, L. Liu, et al., Laser Photonics Rev. P.DOI: 10.1002/lpor.200900033 (2010).
3. L. Alloatti,, et al., "42.7 Gbit/s electro-optic modulator in silicon technology," Opt. Exp. 19, 11841-1185(2011).
4. M. Lamponi, S. Keyvaninia, et al., "Low-Threshold Heterogeneously Integrated InP/SOI Lasers With a Double Adiabatic Taper Coupler," IEEE Photon. Technol. Lett. 24, 76-78 (2012).
5. S. Keyvaninia, M. Muneeb, et al., "Multiple die-to-wafer adhesive bonding for heterogeneous integration ," presented at the 16th European Conference on Integrated Optics, Barcelona, Spain, April 2012, in press.