SCOPUS 정보 검색 플랫폼

ECS Transactions

Volumn 45, Issue 3, 2012, Pages 515-528

Dry adhesives for MEMS assembly, manipulation and integration: Progress and challenges

(1) Sameoto, D a

a UNIVERSITY OF ALBERTA (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); MANUFACTURE; MATERIALS HANDLING; MEMS; MICROMACHINING; NANOSYSTEMS; PACKAGING MATERIALS; VAN DER WAALS FORCES;

ADHESIVE SURFACES; FABRICATION PROCESS; MECHANICAL FIBERS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); OPERATING PRINCIPLES; PACKAGING PROCESS; POLYMER TRANSFER; TRANSFERRING MATERIALS;

ADHESIVES;

ADHESION; ADHESIVES; BEND STRENGTH; FORCE; MATERIALS HANDLING; PACKAGING;

EID: 84869040253 PISSN: 19385862 EISSN: 19386737 Source Type: Conference Proceeding
DOI: 10.1149/1.3700916 Document Type: Conference Paper

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.