Direct molding of dry adhesives with anisotropic peel strength using an offset lift-off photoresist mold

Journal of Micromechanics and Microengineering

Volumn 19, Issue 11, 2009, Pages

  Sameoto, D ^a   Menon, C ^a  

^a SIMON FRASER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DRY ADHESIVE; MASK PROCESS; PEEL STRENGTH; PHOTORESIST MOLDS; WAFER SCALE;

SILICONES;

ANISOTROPY;

EID: 70350660693     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/11/115026     Document Type: Article

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