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Volumn 45, Issue 6, 2012, Pages 93-99

From MEMS-CMOS towards heterogeneous integration over scale

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ENERGY CONVERSION; FUNCTIONAL MATERIALS; INORGANIC COMPOUNDS; INTEGRATION; MICROSENSORS;

EID: 84869016221     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3700942     Document Type: Conference Paper
Times cited : (1)

References (13)
  • 3
    • 84879549610 scopus 로고    scopus 로고
    • http://www.all4engineers.com/freebook/a4e-ebooks/211-222-grieco.pdf
  • 7
    • 84879550270 scopus 로고    scopus 로고
    • http://www.beanspj.org/
  • 9
    • 84879555864 scopus 로고    scopus 로고
    • in Japanese
    • http://pr.fujitsu.com/jp/news/2006/06/6.html (in Japanese)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.