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Volumn 45, Issue 6, 2012, Pages 93-99
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From MEMS-CMOS towards heterogeneous integration over scale
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
ENERGY CONVERSION;
FUNCTIONAL MATERIALS;
INORGANIC COMPOUNDS;
INTEGRATION;
MICROSENSORS;
CHIP-SIZE SYSTEM;
CMOS TECHNOLOGY;
DEVICE PACKAGING;
HETEROGENEOUS INTEGRATION;
INORGANIC CHEMISTRY;
MICROMACHINING TECHNOLOGIES;
MORE THAN MOORE;
MOVING MECHANISMS;
CMOS INTEGRATED CIRCUITS;
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EID: 84869016221
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.3700942 Document Type: Conference Paper |
Times cited : (1)
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References (13)
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