Predictive modeling of electromechanical impedance spectroscopy for composite materials

Structural Health Monitoring

Volumn 11, Issue 6, 2012, Pages 671-683

  Gresil, Matthieu ^a   Yu, Lingyu ^a   Giurgiutiu, Victor ^a   Sutton, Michael ^a  

^a The Department of Mechanical Engineering   (United States)

Author keywords

composite materials; Electromechanical impedance spectroscopy; finite element modeling; piezoelectric wafer active sensors; structural health monitoring

Indexed keywords

AIRCRAFT STRUCTURE; BONDING LAYERS; DAMAGE MODEL; ELECTROMECHANICAL BEHAVIOR; ELECTROMECHANICAL CONVERSION; ELECTROMECHANICAL IMPEDANCE; EXPERIMENTAL VALIDATIONS; FINITE ELEMENT MODELING; GLASS-FIBER REINFORCED POLYMER COMPOSITES; HOST STRUCTURE; IMPEDANCE RESPONSE; INPUT AND OUTPUTS; LAMINATED GLASS; LOW AND HIGH FREQUENCIES; ORTHOTROPIC STRUCTURE; PIEZOELECTRIC WAFER ACTIVE SENSORS; PIEZOELECTRIC WAFERS; PREDICTIVE MODELING; SELF-SENSING; STRUCTURAL HEALTH MONITORING TECHNOLOGY;

AIRCRAFT MANUFACTURE; AIRFRAMES; COMPOSITE MATERIALS; COMPOSITE STRUCTURES; FIBER REINFORCED PLASTICS; FINITE ELEMENT METHOD; GLASS FIBERS; PIEZOELECTRICITY; SENSORS; STRUCTURAL HEALTH MONITORING; WAFER BONDING;

SPECTROSCOPY;

AIR CRAFT; CHIPS; COMPOSITES; FINITE ELEMENT ANALYSIS; GLASS FIBERS; MATHEMATICAL MODELS; PIEZOELECTRICITY; REINFORCED PLASTIC; SENSORS; SPECTROSCOPY;

EID: 84868712080     PISSN: 14759217     EISSN: 17413168     Source Type: Journal    
DOI: 10.1177/1475921712451954     Document Type: Article

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