The effects of adhesive on the electro-mechanical response of a piezoceramic transducer coupled smart system

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5062, Issue 1, 2002, Pages 241-247

  Ong, C W ^a   Yang, Y ^a   Wong, Y T ^a   Bhalla, S ^a   Lu, Y ^a   Soh, C K ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Adhesive; Admittance; Conductance; Electro mechanical; Impedance; Piezoceramic transducers; S hear lag; Structural health monitoring; Susceptance; Systems identification

Indexed keywords

ADHESIVES; BONDING; CERAMIC MATERIALS; COMPOSITION EFFECTS; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; IDENTIFICATION (CONTROL SYSTEMS); INTELLIGENT MATERIALS; LEAD COMPOUNDS; MATHEMATICAL MODELS; THICKNESS MEASUREMENT;

ELECTROMECHANICAL RESPONSE; HEALTH MONITORING; PIEZOCERAMIC TRANSDUCER; SHEAR LAG; SMART SYSTEM;

PIEZOELECTRIC TRANSDUCERS;

EID: 1342269520     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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