Understanding and optimizing delamination/recycling of printed circuit boards using a supercritical carbon dioxide process

Journal of Cleaner Production

Volumn 41, Issue , 2013, Pages 174-178

  Sanyal, Sriya ^a   Ke, Qingdi ^b   Zhang, Yuan ^a   Ngo, Thao ^a   Carrell, John ^b   Zhang, Hongchao ^b   Dai, Lenore L ^a  

^a Arizona State University   (United States)

^b Texas Tech University   (United States)

Author keywords

Delaminating mechanisms; Delamination; Printed circuit board (PCB) recycling; Supercritical carbon dioxide

Indexed keywords

CARBON DIOXIDE; CARBON DIOXIDE PROCESS; CHARACTERIZATION; DELAMINATION; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; EFFLUENT TREATMENT; ELECTRONIC WASTE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; PRINTED CIRCUIT MANUFACTURE; RECYCLING; SEPARATION; SUBSTRATES; SUPERCRITICAL FLUID EXTRACTION; SUPERCRITICAL FLUIDS; TEMPERATURE; TIMING CIRCUITS; WATER RECYCLING;

ENVIRONMENTALLY BENIGN; GENERATIONS OF INNOVATIONS; MATERIAL CHARACTERIZATIONS; PRINTED CIRCUIT BOARDS (PCB); SEPARATION TECHNOLOGIES; SUPERCRITICAL CARBON DIOXIDES; SUPERCRITICAL CONDITION; SUPERCRITICAL FLUID PROCESS;

PRINTED CIRCUIT BOARDS;

EID: 84868703469     PISSN: 09596526     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jclepro.2012.10.011     Document Type: Article

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