Low-temperature sintering of nanoscale silver paste for power chip attachment

CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems, Proceedings

Volumn , Issue , 2008, Pages 121-126

  Lu, Guo Quan ^a,b   Calata, Jesus N ^a   Lei, Thomas G ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

JOINING; NANOTECHNOLOGY; PARTICLE SIZE; POWER ELECTRONICS; SUBSTRATES; TEMPERATURE; THICK FILMS;

CHIP ATTACHMENT; ELECTRONICS MANUFACTURERS; LOW-TEMPERATURE SINTERING; LOWS-TEMPERATURES; NANOSCALE SILVER PASTE; POWER CHIPS; POWER-ELECTRONICS; SEMICONDUCTOR CHIPS; SILVER PASTES; SINTERING TEMPERATURES;

SINTERING;

EID: 84868553807     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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