Two-phase thermosyphon loop for cooling outdoor telecommunication equipments

Applied Thermal Engineering

Volumn 50, Issue 1, 2013, Pages 1351-1360

  Samba, Ahmadou ^a   Louahlia Gualous, Hasna ^a   Le Masson, Stéphane ^b   Nörterhäuser, David ^b  

^a Université de Caen Normandie   (France)

^b ORANGE LABS   (France)

Author keywords

Condenser; Evaporation; Fill ratio; Heat transfer; Passive cooling; Thermal resistance; Thermosyphon loop; Two phase flow

Indexed keywords

AIR CONVECTION; EXPERIMENTAL INVESTIGATIONS; FILL RATIO; FILLING RATIO; FRANCE TELECOM; HIGH BIT RATES; MASS FLOW RATE; N-PENTANE; OPERATING TEMPERATURE; PASSIVE COOLING; POWER SUPPLY; STEADY STATE; TELECOM NETWORKS; TELECOMMUNICATION STANDARDS; THERMOSYPHON LOOPS; TWO-PHASE THERMOSYPHON; WORKING FLUID;

CAPILLARY FLOW; CONDENSERS (LIQUEFIERS); COOLING; EVAPORATION; FLUIDS; HEAT RESISTANCE; HEAT TRANSFER; PARAFFINS; SIPHONS; TELECOMMUNICATION EQUIPMENT; TELECOMMUNICATION SERVICES; TELECOMMUNICATION SYSTEMS; THERMAL LOAD; THERMOELECTRIC EQUIPMENT;

COOLING SYSTEMS;

EID: 84868499601     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.05.023     Document Type: Conference Paper

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