A CFD analysis of an electronics cooling enclosure for application in telecommunication systems

Applied Thermal Engineering

Volumn 30, Issue 16, 2010, Pages 2426-2434

  Boukhanouf, R ^a   Haddad, A ^b  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^b Nuventix Inc   (Germany)

Author keywords

CFD; Electronics cooling; Flotherm; Heat spreader; RF components

Indexed keywords

CFD; ELECTRONICS COOLING; FLOTHERM; HEAT SPREADERS; RF COMPONENTS;

COMPUTATIONAL FLUID DYNAMICS; COOLING; COOLING SYSTEMS; ENCLOSURES; ENERGY UTILIZATION; HEATING EQUIPMENT; POLYCHLORINATED BIPHENYLS; RADAR SYSTEMS; SPREADERS;

TEMPERATURE;

EID: 77956230470     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2010.06.012     Document Type: Article

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