Inducing compressive residual stress in microscale print-lines for flexible electronics

International Journal of Engineering Science

Volumn 62, Issue , 2013, Pages 157-164

  Zohdi, T I ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Damage; Electronics; Print lines; Thermal shrinkage

Indexed keywords

BI-MATERIAL INTERFACES; COMPRESSIVE RESIDUAL STRESS; COMPRESSIVE STATE; DAMAGE; DEPOSITED MATERIALS; ELASTIC PROPERTIES; FINITE CURVATURE; FLEXIBLE SUBSTRATE; INDUSTRIAL DEVICES; MANUFACTURING PROCESS; MATHEMATICAL EXPRESSIONS; MICRO-SCALES; PRINT-LINES; PRINTED ELECTRONICS; RESIDUAL TENSILE STRESS; SUBSTRATE INTERFACE; THERMAL EXPANSION COEFFICIENTS; THERMAL SHRINKAGE; THERMOMECHANICAL MODEL;

DEPOSITS; ELECTRONIC EQUIPMENT; INTERFACES (MATERIALS); TENSILE STRESS; THERMAL EXPANSION;

INTERFACE STATES;

EID: 84868470116     PISSN: 00207225     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijengsci.2012.09.004     Document Type: Article

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