Electromagnetic characterization of paper-glue compound for system-in-package on paper (SiPoP) future developments

IEEE Microwave and Wireless Components Letters

Volumn 22, Issue 10, 2012, Pages 545-547

  Lolli, Francesca ^a   Virili, M ^a   Orecchini, G ^a   Dionigi, M ^a   Alimenti, F ^a   Mezzanotte, P ^a   Roselli, L ^a  

^a UNIVERSITY OF PERUGIA   (Italy)

Author keywords

Microwave measurements of dielectrics; Multilayer circuits; Paper electronics; Paper inkjet printing; Passive components; System in a package (SiP)

Indexed keywords

COMPOUND MATERIAL; ELECTROMAGNETIC CHARACTERIZATION; ERROR BARS; LOSS TANGENT; MECHANICAL TOLERANCES; MULTILAYER CIRCUITS; MULTILAYER MATERIALS; PAPER ELECTRONICS; PASSIVE COMPONENTS; PERMITTIVITY AND LOSS; RELATIVE PERMITTIVITY; SYSTEM IN A PACKAGES; SYSTEM IN PACKAGE; SYSTEMS IN PACKAGES; TEST FIXTURE; VECTOR NETWORK ANALYZERS;

CHARACTERIZATION; FITS AND TOLERANCES; GLUES; GLUING; PERMITTIVITY; SCATTERING PARAMETERS; UNCERTAINTY ANALYSIS;

PAPER;

ELECTRONICS; GLUE; GLUING; MEASUREMENT; MICROWAVES; PAPER; PRINTING;

EID: 84867401610     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2012.2218278     Document Type: Article

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