System integration of electronic functions in smart packaging applications

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 10, 2012, Pages 1723-1734

  Nilsson, Hans Erik ^a   Unander, Tomas ^a,b   Siden, Johan ^a   Andersson, Henrik ^a   Manuilskiy, Anatoliy ^a   Hummelgard, Magnus ^a   Gulliksson, Mikael ^a  

^a MID SWEDEN UNIVERSITY   (Sweden)

^b SCA R and D Center   (Sweden)

Author keywords

Large area sensors; printed electronics; smart packaging

Indexed keywords

3-D INTEGRATION; CONDUCTIVE INK TECHNOLOGY; DESIGN FREEDOM; ELECTRONIC FUNCTIONS; LARGE AREA SENSORS; LARGE-AREA ELECTRONICS; NEW APPLICATIONS; NICHE PRODUCTS; PACKAGING APPLICATIONS; PRINTED ELECTRONICS; RADIO FREQUENCY IDENTIFICATION TAGS; SILICON DEVICES; SMART PACKAGING; STANDARD SOLUTIONS; SYSTEM INTEGRATION; TECHNOLOGY FIELDS; TECHNOLOGY SOLUTIONS;

DESIGN; RADIO FREQUENCY IDENTIFICATION (RFID);

TECHNOLOGY;

EID: 84867210457     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2204056     Document Type: Article

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